Known Issues

1. SDK 2.0.2.11: The openmp_dsp_<target>_02_02_01_03 directory does not contain a properly built product library. The SDK only includes source code. To cirrect this follow the directions in the README.txt file in the openmp_dsp_<target>_02_02_01_03 directory to setup the build environment. Then build with the following command:

make USE_BIOS=1 BUILD_<target>=1 -f utils/product/Makefile .zipfile

<target> is one of AM572, C6678 (use for c6672 and c6674), C6670, C6657, K2H (use for K2E and K2L) and K2G.

The built product will be installed in an ./exports subdirectory. Install ./exports/openmp_dsp_<target>_02_02_01_03 as a RTSC product in CCS.